JPH0314225B2 - - Google Patents

Info

Publication number
JPH0314225B2
JPH0314225B2 JP60019687A JP1968785A JPH0314225B2 JP H0314225 B2 JPH0314225 B2 JP H0314225B2 JP 60019687 A JP60019687 A JP 60019687A JP 1968785 A JP1968785 A JP 1968785A JP H0314225 B2 JPH0314225 B2 JP H0314225B2
Authority
JP
Japan
Prior art keywords
lead
insulating film
pieces
lead frame
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60019687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60253252A (ja
Inventor
Masao Hino
Susumu Sato
Akira Watanabe
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60019687A priority Critical patent/JPS60253252A/ja
Publication of JPS60253252A publication Critical patent/JPS60253252A/ja
Publication of JPH0314225B2 publication Critical patent/JPH0314225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60019687A 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法 Granted JPS60253252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60019687A JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60019687A JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP18330981A Division JPS5921175B2 (ja) 1981-11-16 1981-11-16 リ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS60253252A JPS60253252A (ja) 1985-12-13
JPH0314225B2 true JPH0314225B2 (en]) 1991-02-26

Family

ID=12006148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60019687A Granted JPS60253252A (ja) 1985-02-04 1985-02-04 リ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS60253252A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806409A (en) * 1987-05-20 1989-02-21 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby

Also Published As

Publication number Publication date
JPS60253252A (ja) 1985-12-13

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